• Temporary Bonding and Debonding
    Temporary bonding and debonding are essential processes in semiconductor manufacturing. This technology involves temporarily bonding a device wafer to a carrier wafer using an intermediate material, which provides physical stability for thin wafers or wafers to be trimmed during processing. This allows the delicate device wafer to be processed with additional mechanical support. The wafer and carrier are debonded once the necessary processing steps ...More
    Temporary Bonding and Debonding
  • Wet Bench Process
    Wet bench systems process multiple wafers simultaneously and are widely used in BEOL processes, including cleaning, etching, and plating. Batch processing offers advantages in terms of throughput and efficiency, making it well-suited for high-volume applications. The equipment optimizes performance by using automated handling, precise chemical delivery, and control systems. Safety measures and waste treatment are integrated to ensure responsible ...More
    Wet Bench Process
  • Polar/Single Wafer Wet Process
    The Polar/Single series represents an advanced system for treating individual semiconductor wafers, widely used in FEOL processes to leverage the output quality. Compared to batch processing methods, single-wafer tools offer notable benefits such as superior process control, customization, decreased contamination risk, and enhanced yield. Single-wafer systems are versatile, can be applied to various applications, and are integrated with features like ...More
    Polar/Single Wafer Wet Process
  • Scientech Will Join SEMICON EUROPA
    Scientech Will Join SEMICON EUROPA. Scan for more product information!
    Slide 5
by Dr. Radut

Scientech Products

Scientech

Cleanroom Support Solution, Customized ESD Solution, Temporary Bonding/De-bonding/Glass Recycle Tool, VertaBake (low temp baking system), Wafer Reclaim, Wet-Bench / Single-Wafer Wet Process Equipment, Used Tool, Remote Control System.

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