Products | Scientech Europe

Temporary Bonding & Debonding	Wafer Support System (3M Solution) Temporary Bonding -Glass Mounter Release Layer Coating -Glass Coater	Temporary Debonding Frame Wafer Demounter Taiko Wafer Demounter
Wafer Reclaim Service	12” Si 6” SiC
Polar/ Single	Cleaning Pre-Clean/ Surface Scrubber Post-Clean Flux Clean Mask Clean Frame Clean	Etching UBM Etch Metal Etch Solder Ball Etch Spin Etch with Immersion function Solvent PR Striper PI Remover
Wet Bench	Cleaning Pre-Clean Post-Clean Flux Clean Final Clean Plating Electro Less Plating	Solvent Tool PR Striper PI Remover Etching Metal Etch Solder Ball Etch

Temporary Bonding and Debonding

Temporary bonding and debonding are essential processes in semiconductor manufacturing. This technology involves temporarily bonding a device wafer to a carrier wafer using an intermediate material, which provides physical stability for thin wafers or wafers to be trimmed during processing. This allows the delicate device wafer to be processed with additional mechanical support. The wafer and carrier are debonded once the necessary processing steps are completed. In this tool, the wafer and carrier are bonded with adhesive through UV curing and debonded via IR laser at room temperature. These processes enable efficient handling and processing of wafers in semiconductor manufacturing.

Process	Application	Advantage
Carrier Alignment Adhesive and Release layer coating UV curing bonding IR release debonding Carrier recycle	Semiconductor back-end process IGBT Semiconductor Wafer Thinning Process Compound Semiconductor: SiC / GaN / GaAs / InP	Room temperature process Cleaning not required (direct dicing) Taiko Dedonder Adaptive for various wafer size

Wafer Reclaim

12″ Wafer Reclaim

Capacity: 160K / Month
Cu and Non-Cu Process

SiC Wafer Reclaim Service

SiC Wafer Reclaim Service: Grinding, Polishing and Reclaim Service
Capacity: 1K / Month

Polar/Single Wafer Wet Process

The Polar/Single series represents an advanced system for treating individual semiconductor wafers, widely used in FEOL processes to leverage the output quality. Compared to batch processing methods, single-wafer tools offer notable benefits such as superior process control, customization, decreased contamination risk, and enhanced yield. Single-wafer systems are versatile, can be applied to various applications, and are integrated with features like real-time monitoring, automated handling, and precise control, significantly improving reliability, efficiency, and productivity. These tools play a pivotal role in attaining high-quality semiconductor devices by enabling precise and controlled treatment on individual wafers.

Cleaning	Etching	Stripper
Pre-Clean/ Surface Scrubber Post-Clean Flux Clean Mask Clean Frame Clean	UBM Etch Metal Etch Solder Ball Etch Spin Etch with Immersion function	PR Striper PI Remover

Process	Application	Advantage
Spray Immersion Clean Remove (Metal, Oxide, Nitride, Polymer)	Semiconductor front-end process Advanced Package and Bumping Compound Semiconductor device: SiC / GaN / GaAs / InP Microelectromechanical (MEMS) LED / Mini LED / Micro LED Wafer/ Panel	Highly customizable according to requirements Applicable to high warpage wafer Applicable to variable wafer size Multi-layer etching High etching rate and uniformity

Wet Bench Process

Wet bench systems process multiple wafers simultaneously and are widely used in BEOL processes, including cleaning, etching, and plating. Batch processing offers advantages in terms of throughput and efficiency, making it well-suited for high-volume applications. The equipment optimizes performance by using automated handling, precise chemical delivery, and control systems. Safety measures and waste treatment are integrated to ensure responsible chemical handling. Batch wet processing plays a crucial role in semiconductor manufacturing, enabling efficient and controlled treatment, and resulting in high-quality devices.

Cleaning	Etching	Stripper
Pre-Clean/ Surface Scrubber Post-Clean Flux Clean Mask Clean Frame Clean	Metal Etch Solder Ball Etch	PR Striper PI Remover

Process	Application	Advantage
Chemical bath soaking Mega-sonic function Clean Remove (Metal, Oxide, Nitride, Polymer)	Semiconductor front-end process Advanced Package and Bumping Compound Semiconductor: SiC / GaN / GaAs / InP Microelectromechanical (MEMS) LED / Mini LED / Micro LED Wafer/ Panel	Highly customizable according to requirements Applicable to high warpage wafer Cassette/ Cassette less type Multiple dry functions High etching uniformity