2024-2025
About Us
1979
Established in Taipei, Taiwan
2013
Publicly listed in Taiwan
10
Service Locations
- ISO 56005:2020 certified
- Awarded as a 7th Mid-Sized Enterprise with High Potential
- ISO 9001:2015 certified – Taipei, Hsinchu, and Hukou sites
- ISO 14001:2015 and ISO 45001:2018 certified – Hukou site
- ISO 22301:2019 compliance audit passed – Hsinchu and Hukou sites
- ISO 27001:2022 compliance audit passed – Hsinchu and Hukou sites
- Bronze Medal – Talent Development Quality Management System (Enterprise Edition)
- ISO 50001:2018 certified – Hukou site
2023
- Certified by Dun & Bradstreet (D-U-N-S® Registered™)
- ISO 9001:2015 certified – Taipei, Hsinchu, and Hukou sites
- ISO 14001:2015 and ISO 45001:2018 certified – Hukou site
- Recipient of the Ministry of Economic Affairs' Industrial Upgrade and Innovation Program Subsidy (Thematic R&D Project)
2022
- Certified by Dun & Bradstreet (D-U-N-S® Registered™)
- ISO 9001:2015 audited – Taipei, Hsinchu, and Hukou sites
- ISO 14001:2015 and ISO 45001:2018 certified – Hukou site
- Passed TIPS-AA 2016 certification
- ISO 22301:2019 certified – Hsinchu and Hukou sites
- ISO 27001:2022 certified – Hsinchu and Hukou sites
2021
- Recognized with the "Health Promotion Mark" through participation in the Healthy Workplace Certification
- Certified by Dun & Bradstreet (D-U-N-S® Registered™)
- ISO 9001:2015 certified – Taipei, Hsinchu, and Hukou sites
- ISO 14001:2015 and ISO 45001:2018 certified – Hukou site
- ISO 22301:2019 certified – Hsinchu and Hukou sites
- Directly approved through documentation review for TIPS-AA 2016 certification
- ISO 27001:2013 certified – Hsinchu and Hukou sites
2020-2016
- 2019 – Certified with Taiwan Intellectual Property Management System (TIPS) – AA level, 2016 edition
- 2018 – Participated in the Healthy Workplace Certification and received the "Health Promotion Mark"
- 2017 – Certified under the 2016 edition of the Taiwan Intellectual Property Management System (TIPS)
- 2016 – Successfully developed 300mm glass carrier wafer debonding equipment
- 2016 – Certified under the 2007 edition of the Taiwan Intellectual Property Management System (TIPS)
2015-2001
- 2015 – 12-inch Glass Coater (Spin Coater) obtained SEMI S2 certification
- 2014 – Successfully developed 8" & 12" single-wafer wet etching and cleaning equipment, and 300mm glass carrier wafer reclamation process
- 2014 – Received the "Outstanding Healthy Workplace" certification and "Dynamic Vitality Award" from the Health Promotion Administration
- 2013 – Publicly listed on the stock exchange on March 12
- 2012 – Registered on the Emerging Stock Market on April 23
- 2009 – Successfully secured domestic semiconductor customer orders and produced 12" self-developed equipment
- 2005 – Invested in SCIENTECH (Shanghai) Trading Co., Ltd. and SCIENTECH ENGINEERING USA CORP
- 2004 – Established Hukou factory, expanding into R&D, production, and sales of semiconductor and optoelectronic process equipment
- 2003 – Hsinchu plant and office building completed and operational
- 2001 – Taipei Neihu office opened
2000-1980
- 1999 – Established the Tainan office to provide localized support for customers in southern Taiwan.
- 1990 – Established the Hsinchu office to serve customers in the Hsinchu Science Park.
Products
| Temporary Bonding & Debonding | Wafer Support System (3M Solution)
| Temporary Debonding
|
|---|---|---|
| Wafer Reclaim Service |
| |
| Polar/ Single | Cleaning
| Etching
Solvent
|
| Wet Bench | Cleaning
Plating
| Solvent Tool
Etching
|
Temporary Bonding and Debonding
Temporary bonding and debonding are essential processes in semiconductor manufacturing. This technology involves temporarily bonding a device wafer to a carrier wafer using an intermediate material, which provides physical stability for thin wafers or wafers to be trimmed during processing. This allows the delicate device wafer to be processed with additional mechanical support. The wafer and carrier are debonded once the necessary processing steps are completed. In this tool, the wafer and carrier are bonded with adhesive through UV curing and debonded via IR laser at room temperature. These processes enable efficient handling and processing of wafers in semiconductor manufacturing.
Process | Application | Advantage |
|---|---|---|
|
|
|
Wafer Reclaim
12″ Wafer Reclaim
- Capacity: 220K / Month
- Cu and Non-Cu Process
Polar/Single Wafer Wet Process
The Polar/Single series represents an advanced system for treating individual semiconductor wafers, widely used in FEOL processes to leverage the output quality. Compared to batch processing methods, single-wafer tools offer notable benefits such as superior process control, customization, decreased contamination risk, and enhanced yield. Single-wafer systems are versatile, can be applied to various applications, and are integrated with features like real-time monitoring, automated handling, and precise control, significantly improving reliability, efficiency, and productivity. These tools play a pivotal role in attaining high-quality semiconductor devices by enabling precise and controlled treatment on individual wafers.
Cleaning | Etching | Stripper |
|---|---|---|
|
|
|
Process | Application | Advantage |
|---|---|---|
|
|
|
Wet Bench Process
Wet bench systems process multiple wafers simultaneously and are widely used in BEOL processes, including cleaning, etching, and plating. Batch processing offers advantages in terms of throughput and efficiency, making it well-suited for high-volume applications. The equipment optimizes performance by using automated handling, precise chemical delivery, and control systems. Safety measures and waste treatment are integrated to ensure responsible chemical handling. Batch wet processing plays a crucial role in semiconductor manufacturing, enabling efficient and controlled treatment, and resulting in high-quality devices.
Cleaning | Etching | Stripper |
|---|---|---|
|
|
|
Process | Application | Advantage |
|---|---|---|
|
|
|