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Temporary Bonding Equipment-Pyxis TB Series

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Temporary Bonding
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Scientech, in collaboration with global leader 3M, has developed the Pyxis series Temporary Bonding Equipment, providing solutions for glass bonding processes in wafer thinning and BGBM (Backside Grinding & Backside Metallization). In addition, leveraging its professional in-house equipment development capabilities in the semiconductor field, Scientech has developed temporary bonding equipment applicable to advanced semiconductor packaging processes.

  • High-efficiency production equipment
  • Lower consumables cost (Low CoO)
  • No wafer cleaning required after debonding

The Pyxis series temporary bonding equipment can be applied in:

  • Semiconductor wafer thinning
  • BGBM (Backside Grinding & Backside Metallization),
  • Compound semiconductor thinning (SiC/GaN)
  • Advanced semiconductor packaging

Its applicable process is:

  • Temporary bonding

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