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Batch Panel-level Wet Process-WSE Panel Series

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Batch Panel-level Wet Process
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As semiconductor packaging evolves toward panel-level packaging. Scientech, leveraging its expertise in in-house batch wet process equipment, has successfully developed panel-level batch wet process equipment to meet market demand, applied in panel-level packaging processes. WSE-panel is an advanced and cost-effective panel-level batch wet process system solution, capable of processing multiple panels in a single batch and equipped with multiple tanks suitable for various chemicals.

  • Customization for hardware and software
  • Excellent particle removal performance
  • Leading-edge technologies
  • Customization for panel sizes

The panel-level packaging equipment series’ batch panel-level wet process equipment can be applied in
panel-level advanced packaging, including:

  • Fan-out panel-level packaging (FOPLP)
  • FoCoS (Fan Out Chip on Substrate)
  • PiFO (Pillar integration FO)

The applicable processes are as follows:

  • Stripper: PR/PI strip, Polymer remove
  • Metal Etch
  • Wafer reclaim

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